Big news, Tata group exports semiconductor chips to foreign countries

The Bengaluru-based R&D center of Tata Electronics Ltd is exporting limited quantities of semiconductor chips packaged on a pilot line, boosting India’s semiconductor industry. Prime Minister Narendra Modi laid the foundation stone for the Tata group’s Rs 27,000 crore indigenous semiconductor assembly and test facility at Jagiroad in Assam’s Morigaon district in March this year.

According to online sources, ‘These packaged chips are being sent to the company’s partners in Japan, America and Europe. Chips packaged by Tata Electronics are being shipped to customers outside the country and the company is expanding its customer base.

The company is also almost in the final stages for successful tape-out of semiconductor chips in 28, 40, 55, and 65 nm (nanometers), and some other higher nodes. Tape-out refers to the result of the design process for integrated circuits or printed circuit boards before they are sent for manufacturing.

“There are several rounds before a successful tape-out. Therefore, some of these products will be in the advanced stages of R&D and sent to select customers to obtain feedback for testing and improvement. Commercial production is scheduled for 2027,” the individual stated.

According to Tata Electronics, the chips are not designed for a specific purpose, so they can be used in multiple products. “When you package chips, it doesn’t matter what they are used for.

Under this initiative, Tata Electronics will export semiconductor chips from India to foreign countries. The samples from the Bengaluru center will be reliable in terms of quality. This will also boost India’s technological capability.

Dholera will be home to India’s first AI-enabled state-of-the-art fab built by Tata Electronics and Taiwan’s Powerchip Semiconductor Manufacturing Corporation (PSMC). It will manufacture chips for power management ICs, display drivers, microcontrollers (MCUs), and high-performance computing logic. The fab will have a manufacturing capacity of up to 50,000 wafers per month and the first chips will come out of the facility before the end of 2026.

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